Workshop Overview
Cast huge investment in LED research and development and the most advanced LED packaging facilities,this creates a stable framework for consistently high performance with pioneering technologies.
Interface attachment with high thermal conductivity bonding method sadhesives between die, submount, leadframe, heat sink, system level cooling.
Consistent phosphor coating process to achieve same lumen per LED with monthly production capacity is 32kk
QC station after LED packaging process-Problem solving for each process step as sampling, pilot run ands high volume successfully
Strict light classification process to ensure the consistance of the CT and lumen output
high efficiency LED high power light assembly with daily production capacity at 2000sets
6 assembly lins contain all important working stations
48 hours water rinse fully approved LED driver and lights are IP67
48 hrs aging test before shipment to ensure the most reliability of LED lights