Workshop Overview

Cast huge investment in LED research and development and the most advanced LED packaging facilities,this creates a stable framework for consistently high performance with pioneering technologies.

Interface attachment with high thermal conductivity bonding method sadhesives between die, submount, leadframe, heat sink, system level cooling.

Consistent phosphor coating process to achieve same lumen per LED with monthly production capacity is 32kk

QC station after LED packaging process-Problem solving for each process step as sampling, pilot run ands high volume successfully

Strict light classification process to ensure the consistance of the CT and lumen output

high efficiency LED high power light assembly with daily production capacity at 2000sets

6 assembly lins contain all important working stations

48 hours water rinse fully approved LED driver and lights are IP67

48 hrs aging test before shipment to ensure the most reliability of LED lights